• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    RFID tags are provided for incorporation into a package of a microwave usable food item, with the RFID tag being configured for safe microwave use. The RFID tag includes a space-defining antenna configured to operate on a first frequency. An RFID chip is electrically coupled to the antenna through space. A protective structure is electrically coupled to the antenna through space and overlaps the RFID chip. The protective structure includes a protective conductor and a protective dielectric at least partially positioned between the protective conductor and the RFID chip. The protective structure is configured to limit voltage across space when the antenna is exposed to a second frequency that is higher than the first frequency. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip.
    公开号:BR112019012930A2
    申请号:R112019012930
    申请日:2017-12-28
    公开日:2019-12-10
    发明作者:Cumby Brad；Strohmeier Brian；Higgins Cameron；Duan Hu；J Forster Ian；Orlowski James；Feltz John；Howard Norman
    申请人:Avery Dennison Retail Information Services Llc；
    IPC主号:
    专利说明:

    Invention Patent Descriptive Report for RFID LABELS WITH PROTECTIVE STRUCTURE FOR INCORPORATION IN PACKING OF FOOD PRODUCTS TO BE USED IN MICROWAVES.
    Cross Reference to Related Application (s) [001] This application claims priority to and benefit from US provisional patent application 62 / 440,108 filed on December 29, 2016 and US provisional patent application 62 / 539,817 filed on August 1, 2017, each of which is incorporated herein by reference in its entirety.
    Background
    Description Field [002] This subject refers to packaging for food product items usable in microwaves. More particularly, the present subject refers to radio frequency identification (RFID) tags incorporated in the packaging for food product items usable in microwaves.
    Description of the Related Art [003] It is known that packaging for food product items usable in a microwave includes cooking aids that have to be arranged inside the microwave oven with the food item to cook / heat the food item. For example, foods with crusts, such as frozen pies or stuffed bread, can benefit from crisp mangoes, which are paper items that at least partially wrap the food item during use in the microwave. Typically, the crisp sleeve has a paper substrate, with a susceptor embedded in the inner surface of the crisp sleeve, which is facing and preferably in contact with the food item. The susceptor, who
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    2/25 can be a metallized film, absorbs microwave energy and converts it to heat, which makes the food item crusty and / or browns the surface or crust, thus improving the appearance and texture of the food item. Due to the absorptive nature of the used film that culms the susceptor, relatively low energy levels are reflected by it, so that it does not reach an arc because it generates high differential voltages between adjacent parts of the film, which may otherwise cause the packaging to catch fire.
    [004] It is also known to incorporate RFID technology, such as an RFID tag, into the product packaging for various purposes, including inventory management and theft prevention. Figure 1 shows an RFID T tag according to the conventional configuration, which can be attached to or otherwise associated with a compartment such as that compartment 13 of Figure 1A (typically, a sleeve or paper or cardboard box) of the packaging 9 for a food item usable in microwave in relation to Figure 1A. The entire package 9 of Figure 1A is not intended for use in a microwave, but instead the food item (and, optionally, the crisp sleeve or the like) is removed from compartment 13 of Figure 1A and inserted in the microwave oven for heating / cooking.
    [005] The RFID T tag of Figure 1 includes an RFID C chip, with a dipole antenna associated with A to transmit information to and / or receive information from an RFID reader (not shown). The RFID C chip is electrically coupled to antenna A through a space G defined by antenna A between two padding areas of conductor P.
    [006] RFID tags inherently must, at some point, have a space through which the RFID chip is arranged that has a voltage at the intended operating frequency when in the field of a
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    3/25 reader device. The required energy incident on the RFID C chip can be as low as 10 microwatts, whereas a microwave oven can typically operate at an energy level in excess of 800 watts, which can generate very high voltages through the G space and the chip Associated RFID C. Antenna A is designed to operate on a first F1 frequency, for example, in the range of approximately 860 MHz to 930 MHz, with antenna A obtaining power incident on the first F1 frequency from an RFID reader and converting the voltage across the RFID C chip to allow it to operate.
    [007] A second frequency applied by the microwave oven, identified in Figure 1 in F2, typically in the order of approximately 2.450 MHz, can also be incident on antenna A when the RFID T tag is placed inside the microwave oven. Antenna A is not designed to operate on the second frequency F2, as the very high power levels incident on the second frequency F2 will generate high voltages on antenna A. Said high voltages can appear in a number of places on antenna A; however, by methods such as introducing large L spaces between the antenna elements and the controlled rays (identified in general in R in Figurei), the voltage through the said elements that could generate a high voltage rupture and, consequently, the arc can be avoided. However, the G space connected by the RFID C chip is necessarily relatively small and, consequently, a high voltage appears on the second frequency F2, whose high voltage can cause a rupture and generate an arc. Illustrated similarly in Figure 1 A; the dipole antenna 17 can receive microwave energy (identified in Figure 1A in M) and reflect the microwave energy (represented in Figure 1A in R) within the microwave source. There is a possibility that an arc can be created between sections
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    4/25 adjacent to dipole antenna 17 (whose location may be between the two conducting elements of dipole antenna 17, as identified in Figure 1A in 19). Additionally, with reference to Figure 1A, the dipole antenna 17 of the conventional RFID tag 11 is formed of a relatively thick, low resistance conductor, which has different properties than the metallic film used to define a typical susceptor. For example, common susceptors are produced from metal-coated films with optical densities ranging from 0.18 to 0.29, which correspond to a sheet resistance of 100 ohms to 230 ohms, whereas a less than
    I ohm per square is commonly used to form the antenna 18 of the RFID tag 11. Due to the characteristics of the dipole antenna 17, the RFID tag 11 can cause some items if it is not dissociated from the food item before placing it in the micro the food item (that is, if the entire package 9 of Figure 1A is arranged inside the microwave oven).
    [008] To avoid problems of this nature, the RFID tag T and
    II of Figure 1 and 1A respectively, are typically configured to be readily removable or otherwise dissociable from the food item, such as by attaching it to the packaging compartment, which may include instructions for not placing the compartment in the microwave . However, it is possible that a user does not take proper care and place the entire packaging (which includes the RFID tag T and 11 shown in Figure 1 and 1A respectively) inside the microwave oven with the food item, thus not dissociating RFID tag T or 11 from the food item. Therefore, it would be advantageous to provide an RFID tag that can be used in a microwave without resulting in the problems associated with using the conventional RFID tag T or 11 in the microwave.
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    5/25
    Summary [009] There are several aspects of this subject that can be incorporated separately or together into the devices and systems described and claimed below. These aspects can be used alone or in combination with other aspects of the subject described here, and the description of these aspects together is not intended to prevent the use of these aspects separately or the claim of such aspects separately or in different combinations as they may. set out in the appended claims.
    [0010] In one aspect, an RFID tag includes an antenna that defines a space and is configured to operate on a first frequency. An RFID chip and an antenna electrically coupled to the antenna through space. The protection structure is electrically coupled to the antenna through space and overlaps with the RFID chip. The protective structure includes a protective conductor and a protective dielectric at least partially positioned between the protective conductor and the RFID chip. The protection structure is configured to limit the voltage across the space when the antenna is exposed to the second frequency which is higher than the first frequency.
    [0011] In another aspect, a package is provided for a food item usable in a microwave. The package includes a compartment and an RFID tag attached to the compartment. The RFID tag includes an antenna that defines a space and is configured to operate on a first frequency. An RFID chip is electrically coupled to the antenna through space. A protective structure is electrically coupled to the antenna through space and overlaps with the RFID chip. The protective structure includes a protective conductor and a protective dielectric at least partially positioned between the protective conductor and the RFID chip. The structure
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    6/25 protection is configured to limit the voltage across the space when the antenna is exposed to the second frequency which is higher than the first frequency.
    [0012] In an additional aspect, an RFID tag includes an antenna that defines a space and configured to operate on a first frequency. An RFID chip is electrically coupled to the antenna through space. The protection structure is electrically coupled to the antenna through space and overlaps with the RFID chip. The protective structure includes a protective conductor and a protective dielectric at least partially positioned between the protective conductor and the RFID chip. A second protection structure is electrically coupled to the antenna through space, underlying the RFID chip. The protection structure is configured to limit the voltage across the space when the antenna is exposed to a second frequency that is higher than the first frequency.
    [0013] In another aspect, a package is provided for a food item usable in a microwave. The package includes a compartment and an RFID tag attached to the compartment. The RFID tag includes an antenna that defines a space and is configured to operate on a first frequency. An RFID chip is electrically coupled to the antenna through space. The protection structure is electrically coupled to the antenna through space and overlaps with the RFID chip. The protective structure includes a protective conductor and a protective dielectric at least partially positioned between the protective conductor and the RFID chip. The second protection structure is electrically coupled to the antenna through space, underlying the RFID chip. The protection structure is configured to limit the voltage across the space when the antenna is exposed to a second frequency that is higher than the first frequency.
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    7/25 [0014] In another aspect the antenna comprised of an antenna with the resistance of the leaf in the range of approximately 100 ohms to approximately 230 ohms. In another aspect, an RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip. The antenna is comprised of a conductor formed of a base material and a second material with different thermal expansion coefficients configured to cause the antenna to fracture into multiple parts when subjected to heating.
    [0015] In yet another aspect, a package is provided for a food item usable in a microwave. The package includes a compartment, an RFID tag, and a bonding material included between the RFID tag and the compartment. The RFID tag includes a substrate and an RFID tag associated with the substrate. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip. The joining material has a higher resistance than the antenna.
    Brief Description of the Drawings [0016] Figure 1 is a top plan view of an RFID tag according to a conventional configuration;
    [0017] Figure 1A is a perspective view of a package for a food item usable in a microwave that incorporates an RFID tag according to a conventional configuration;
    [0018] Figure 2A is a top plan view of an RFID tag according to aspects of the present description, which can be incorporated in the package for a food item usable in microwave;
    [0019] Figure 2B is a side view in cross section of a portion of the RFID tag of Figure 2A, attached to the packaging for a food item usable in microwave;
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    8/25 [0020] Figure 3A is a top plan view of another embodiment of an RFID tag according to aspects of the present description, which can be incorporated in the package for a food item usable in microwave;
    [0021] Figure 3B is a side view in cross section of a portion of the RFID tag of Figure 3A, attached to the packaging for a food item usable in microwave;
    [0022] Figure 4A is a top plan view of a third embodiment of an RFID tag according to aspects of the present description, which can be incorporated in the package for a food item usable in microwave;
    [0023] Figure 4B is a side view in cross section of a portion of the RFID tag of Figure 4A;
    [0024] Figure 5 is a top plan view of a fourth embodiment of an RFID tag according to aspects of the present description, which can be incorporated in the package for a food item usable in microwave;
    [0025] Figure 6A is a top plan view of a fifth embodiment of an RFID tag according to aspects of the present description, which can be incorporated in the package for a food item usable in microwave;
    [0026] Figure 6B is a side view in cross section of a portion of the RFID tag of Figure 6A, attached to the packaging for a food item usable in microwave;
    [0027] Figure 7A is a top plan view of a sixth embodiment of an RFID tag according to aspects of the present description, which can be incorporated in the package for a food item usable in microwave;
    [0028] Figure 7B is a cross-sectional side view of a portion of the RFID tag of Figure 7A; and
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    9/25 [0029] Figure 8 illustrates a basic equivalent circuit of a portion of an RFID tag according to aspects of the present description.
    [0030] Figure 9 is a perspective view of a package for a food item usable in a microwave that incorporates an RFID tag according to aspects of the present description;
    [0031] Figure 10 is a top plan view of an alternative embodiment of an RFID tag antenna according to aspects of the present description, which can be incorporated in the package for a food item usable in microwave;
    [0032] Figure 10A is a top plan view of the antenna of Figure 10 after heating; and [0033] Figure 11 is an exploded perspective view of an alternative embodiment of the packaging for a food item usable in a microwave that incorporates an RFID tag according to aspects of the present description.
    Description of the Illustrated Modalities [0034] As necessary, detailed modalities of the present invention are described here; however, it should be understood that the embodiments described are merely examples of the present invention, which can be incorporated in several ways. Therefore, specific details described herein are not to be construed as limiting, but merely as a basis for the claims and as a representative basis for teaching those skilled in the art to employ the present invention in a variety of ways in any suitable manner.
    [0035] Figures 2A and 2B show an RFID tag 10 in accordance with the present description, while Figure 2B shows the RFID tag, generally designated as 10, attached to compartment 12 (for example, a paper box) of packaging , generally
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    10/25 designated as 14, for a food item usable in the microwave. Package 14 may include other items, such as the crisp sleeve configured to go to the microwave with the food item. The RFID tag 10 can be incorporated into the package 14 by any suitable approach and, while the RFID tag 10 is attached to the compartment 12 in the form of Figure 2B, the RFID tag 10 can be associated with another portion of the package 14 (for example, the crisp sleeve housed inside compartment 12) in other modalities. In addition, although RFID tags are described here as being incorporated into the packaging of a microwave-usable food item, it should be understood that RFID tags according to the present description can be useful in any of a number of possible applications, particularly when it is contemplated that they may be exposed to frequencies (referred to here as the second frequency) that are significantly higher than the frequency (referred to here as the first frequency) at which an RFID tag antenna is intended to operate.
    [0036] The RFID tag 10 includes an antenna 16 with an RFID chip 18 electrically coupled to it. Antenna 16 is provided as a dipole antenna, which is formed of a conductor that defines a space 20 between two padding areas of conductor 22 (Figure 2A), which is connected by RFID chip 18. Antenna 16 and RFID chip 18 can be provided in general according to a conventional configuration (for example, as described above with respect to the modality of Figure 1), with antenna 16 being designed to operate on a first frequency, which can be in the range of approximately 860 MHz to 930 MHz. As with the conventional RFID tag T, antenna 16 captures the energy incident on the first frequency and converts it into voltage via the RFID chip 18
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    11/25 to allow it to operate.
    [0037] The RFID 18 chip can take any one of a number of forms (including those of the type commonly referred to as a chip or a strap by one skilled in the art), which includes any of a number of possible components and being configured to perform any of a number of possible functions. For example, in one embodiment, the RFID 18 chip includes an integrated circuit to control RF communication and other functions of the RFID tag 10.
    [0038] The RFID tag 10 additionally includes the protective structure, generally designated as 24, which is comprised of a protective conductor 26 and a protective dielectric 28. The protective conductor 26 is formed of a material having conductive properties and , as will be described in more detail, can be configured in a variety of ways without deviating from the scope of the present description. The protective dielectric 28 is formed of a material having dielectric properties and, as will be described in more detail, it can be configured in a variety of ways without deviating from the scope of the present description. For example, in the form of Figures 2A and 2B, the protective conductor 26 and the protective dielectric 28 are generally flat or planar, substantially similarly formed, and oriented with the perimeter of the protective conductor 26 coinciding with the perimeter of the protective dielectric 28. In other embodiments, the protective conductor and the protective dielectric can be configured and / or oriented differently at least partially out of alignment (that is, with a portion of the protective conductor extending ahead of the perimeter protection dielectric and / or a portion of the protection dielectric extending ahead of the protective conductor perimeter).
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    12/25 [0039] The protection structure 24 is electrically coupled to the antenna 16 through the space 20, being coupled by capacitance to the padding areas of the conductor 22 on each side of the space 20 (Figure 2A). As shown in Figure 2B, the protective structure 24 overlaps the RFID chip 18, with the protective dielectric 28 at least partially positioned between the RFID chip 18 and the protective conductor 26. The protective structure 24 can overlap or cover whole (as in Figures 2A and 2B) or just a portion of the space
    20.
    [0040] As described above, it is possible for RFID tag 10 to be exposed to signals operating on the first or second frequencies. When the RFID tag 10 is exposed to a first frequency, the protection structure 24 forms a partial short circuit across the space 20. However, the antenna 16 is configured to compensate for the presence of the partial short circuit, thereby allowing that the RFID tag 10 operates properly.
    [0041] As described above, when the conventional RFID tag T is exposed to the second frequency F2, a great tension arises through the G space, which risks creating an arc. If the voltage and energy at the second frequency F2 are sufficiently limited, the RFID C chip can survive, but the main objective is to avoid an arc that could ignite the RFID T tag or the packaging 14 in which it is incorporated. The protection structure 24 of Figures 2A and 2B provides this function by promoting a short in the high voltage generated through space 20 (and, consequently, the RFID chip 18) when RFID tag 10 is exposed to the second frequency, thereby reducing the voltage below the level that can cause a rupture and possible arc, which prevents ignition. Therefore, the RFID 10 tag can be arranged in a microwave and exposed to the concomitant high frequency signals (which can be of the order of
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    13/25 approximately 2.450 MHz) without the risk of ignition, different from the conventional RFID tag T.
    [0042] The protection structure can be configured in a variety of ways without deviating from the scope of the present description, as noted above. For example, Figures 3A and 3B show an embodiment of an RFID tag, generally designated as 10a, (and associated packaging, generally designated as 14a, in Figure 3B) in which the protection structure 24a includes a configured protection dielectric differently 28a (Figure 3B). In the form of Figures 3A and 3B, the protection dielectric 28a is incorporated in an overlay layer, which overlays the RFID chip 18, at least a portion of the space 20, and at least a portion of the padding areas of the conductor 22 of the antenna 16 (Figure 3A). The protective conductor 26a can comprise a standardized conductor to provide the desired bonding and protective effects. As best seen in Figure 3B, the protective conductor 26a and the protective dielectric 28a can be differently sized and formed, with the protective conductor 26a being smaller than the overlaminating layer within which the protective dielectric 28a is embedded.
    [0043] Figures 4A and 4B illustrate another embodiment of an RFID tag, generally designated as 10b, in accordance with the present description. In the embodiment of Figures 4A and 4B, the protection structure, generally designated as 24b, is incorporated in an RFID strap comprised of a strap conductor 30 and a strap substrate 32 (together with the RFID chip 18), which is electrically coupled to the antenna 16, through space 20. The protective structure 24b can be comprised of a protective conductor 26b applied to the strap substrate 32, which serves as the protective dielectric 28b. The strap substrate 32 (and any other protective dielectrics
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    14/25 described here) can be formed from any of a variety of materials, such as polyethylene terephthalate.
    [0044] Figure 5 illustrates another modality of an RFID tag, generally designated as 10c, with a differently configured protection structure 24c. In the embodiment of Figure 5, the protective conductor 26c includes an extended area 34, which can increase the size of the protective conductor 26c in addition to that of the associated protective dielectric (which is not visible in Figure 5). Unlike other modalities, in which the protective structure is mainly configured and oriented to overlap or cover the space 20, the extended area 34 of the protective conductor 26c is oriented so as not to overlap the space 20 (or the antenna 16 ), but instead is positioned laterally to the antenna 16 and to the space 20, extending away from the antenna 16. The extended area 34 of the protective conductor 26c can be varied and configured without deviating from the scope of the present description, being approximately the same size as the protective conductor 26 of Figures 2A and 2B in one embodiment, larger than the protective conductor 26 of Figures 2A and 2B in another embodiment, and smaller than the protective conductor 26 of Figures 2A and 2B in yet another embodiment.
    [0045] Regardless of the size or the particular configuration of the extended area 34 of the protective conductor 26c, the extended area 34 helps to dissipate the heat generated through space 20. This effect is increased by increasing the size of the extended area 34, from so that it can be advantageous for the extended area 34 to be relatively large for improved heat dissipation. The extended area 34 (along with the rest of the protective conductor 26c, as well as any of the other protective conductors described here) may be formed of a non-flammable material, such as but not
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    15/25 limited to an aluminum material, heat resistant, flame resistant paper (Flex Dura HR, http://www.flexlinkllc.com/heat-resistantpaper.html), and non-flammable adhesive (Eclectic E6000 Adhesive, http : //eclecticproducts.com/products/e6000.html) to provide a barrier to any arc that can be generated through space 20 to prevent a fire from spreading.
    [0046] Figures 6A and 6B illustrate yet another modality of an RFID tag, generally designated as 10d, (and associated packaging, generally designated as 14d, in Figure 6B) with the differently configured protection structure 24d. In the embodiment of Figures 6A and 6B, the protection dielectric 28d is formed of a material that undergoes a breakdown of the reversible or non-reversible dielectric at high voltages of the type induced by a high-power microwave field. By such a configuration, the short circuit effect provided by the protection structure 24d in the presence of the second frequency (for example, in a microwave field) can be increased. In said embodiment (as well as in other embodiments described here), the protective conductor 26d can be formed by printing a conductive material (which becomes and defines the protective conductor 26d) on the protective dielectric 28d, such as an overamination.
    [0047] A single RFID tag can include more than one protection structure, as shown in the form of Figures 7A and 7B. In Figure 7A, the RFID tag, generally designated as 10e, is provided with a first protection structure, generally designated as 24e, generally in accordance with the preceding description of the embodiment of Figures 3A and 3B. Instead of the antenna 16 on the RFID tag 10e being free for direct connection to the packaging compartment (as in Figure 3B), the second protection structure, generally designated as 24f, (Figure 7B) is associated with a side of
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    16/25 below antenna 16, with the second protection structure 24f underlying the RFID chip 18 (ie, with protection structures 24e and 24f electrically coupled to the opposite faces of antenna 16). The protective dielectric 28f of the second protective structure 24f contacts the underside of the antenna 16, while the associated protective conductor 26f is free to be attached or otherwise associated with the food packaging compartment that can go to the microwave or similar.
    [0048] In the illustrated embodiment, the second protective structure 24f is substantially identical to the first protective structure 24e, but it is within the scope of the present description that the protective conductor 26f and / or the protective dielectric 28f of the second protective structure 24f is configured differently from the protective conductor 26e and the protective dielectric 28e of the first protective structure 24e. Regardless of the particular configurations of the two protection structures 24e and 24f, by providing the same on both sides of the antenna 16, additional protection is provided. Said additional protection involves a short circuit, additional in that there are now two partial short circuits through space 20. However, according to the preceding description of the modality of Figures 2A and 2B, antenna 16 is configured so that compensate for the presence of partial short circuits, thereby allowing the RFID 10e tag to operate properly when exposed to the first frequency.
    [0049] Figure 8 is a basic equivalent circuit that represents the basic components of an RFID 10 tag according to the present description. In Figure 8, the space 20 defined by the antenna 16 is connected by an RFID chip 18 (represented by a resistor Rp and a capacitor Cp) and the protection structure 24 that comprises a protective conductor 26 and a protective dielectric 28 (represented
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    17/25 by identical capacitors Cb in series). The total capacitance of the protection dielectric 28 is half the capacitance of the individual capacitors Cb used to represent the protection dielectric 28 in Figure 8. This is calculated using the standard formula where the total capacitance of a series of capacitors is the inverse of the sum of all inverse capacitances.
    [0050] The impedance of the protection dielectric 28 is equal to the inverse of the product of 2 x π x F x total capacitance, where F is the frequency at which the RFID tag 10 is activated. Thus, if the first frequency is in the order of approximately 800 MHz and the second frequency is in the order of approximately 2,400 MHz, then the impedance drops by a factor of approximately three between the first and second frequencies, which increases the short circuit and , consequently, the protection effect on the second frequency.
    [0051] Additionally, there is a possibility that an arc can be created between adjacent sections, that is, G space and associated RFID chip C. This is partly due to adjacent sections being surrounded by a material (ie, air or other elements) having a lower dielectric strength than that of the electric field reached by said differential voltages through said adjacent sections. An arc can also be created and exacerbated in part by virtue of the materials surrounding the said sections that reach the temperature, by virtue of the RF current flowing along / through said spaces of adjacent sections G and chip C, which decrease the dielectric strength of the surrounding material, as well as creating flammable / volatile fuels. This arc can be avoided without the use of protection by wrapping said sections with a material having properties such as; a dielectric resistance that can resist the electric field in those sections, in addition to having heat resistance, flame resistance and properties
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    18/25 non-flammable, ie paper with heat resistance and flame resistance and non-flammable adhesive (s).
    [0052] Furthermore, within the same scope of the present invention, additional modalities are described. In the illustrated embodiment of Figure 9, compartment 23 is associated with the RFID tag 25 includes an RFID chip 27 with an antenna 29 electrically coupled to it. Antenna 29 is formed of a conductor 31 having a resistance that is greater than the resistance of antenna 18 of conventional RFID tag 11, which allows package 21 (which includes RFID tag 25) to be used in the microwave in safety. For example, conductor 31 may have a sheet resistance that is comparable to that of a susceptor's sheet resistance (i.e., in the range of approximately 100 ohms to approximately 230 ohms). Conductor 31 may also have an optical density in the range of approximately 0.18 to 0.29, similar to a susceptor. By such a configuration, when the RFID tag 25 is placed in the microwave, it acts in the sense that a susceptor when being placed in the microwave, by absorbing microwave energy M and heating and reflecting minimum energy R ' , instead of reflecting high energy levels for the microwave source or creating an arc.
    [0053] The higher resistance of the conductor sheet 31 can affect the efficiency of the antenna 29 compared to the dipole antenna 17 of a typical RFID tag 11. Although the resistance of the material sheet (measured in ohms per square at a given thickness) is a fixed value, the resistance experienced by an RF current flowing through the conductor 31 can be effectively reduced by increasing the area of the conductor 31 (for example, by increasing its thickness). This is particularly effective in reducing resistance for an RF current, as the depth of the skin is more of a factor than for the DC current, due to the
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    19/25 RF current flowing on the outer surface of the conductor 31 (that is, as the thickness of the conductor is reduced with respect to the depth of the skin, the RF resistance becomes higher than the DC resistance would be). Therefore, it may be advantageous for antenna 29 to have a relatively large area or thickness to reduce RF resistance.
    [0054] Compared to the dipole antenna, the conductor of a hybrid frame-slot antenna typically has a larger area, so it may be advantageous for antenna 29 to be provided as a hybrid frame-slot antenna (sometimes referred to as a sloop antenna), as in Figure 9. Said hybrid frame-slot antenna 29 can be formed of a conductor 31 which comprises a conductor sheet which, in the illustrated embodiment, is generally rectangular, with a groove 33 defined therein and positioned at an edge or end 35 of the conductor sheet 31. As shown, the groove 33 can extend between a closed end 37 and an open end 39 associated with the end or edge 35 of the conductor sheet 31. Although there are several advantages to antenna 29 being configured as a hybrid slot-frame antenna is within the scope of the present description for an antenna 29 to be configured in a variety of ways.
    [0055] In addition to looking at the RFID 27 chip, it can take any of a number of ways (including those of the type commonly referred to as a chip or a strap by one skilled in the art), which includes any of a number of possible components and configured to perform any of a number of possible functions. For example, in one embodiment, the RFID 27 chip includes an integrated circuit to control RF communication and other functions of the RFID tag 25. In the illustrated embodiment, two ends or points of the RFID 27 chip are connected to the sheet
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    20/25 of conductor 31 on opposite sides of the groove 33, adjacent to the open end 39 of the groove 33, which serves to electrically couple the RFID chip 27 to the conductor sheet 31.
    [0056] According to another aspect of the present description, which can be incorporated in the antenna 29 of the RFID tag 25 of Figure 9 or can be practiced separately, an RFID tag 41 (Figures 10 and 10A) that is suitable for incorporation in the packaging for a food item usable in a microwave can be configured to fracture into multiple pieces or otherwise dissociate when subjected to heating in a microwave oven. As it breaks, the interaction with the microwave field is reduced, thus avoiding potential problems of excessive reflected microwave energy and / or the creation of an arc when the RFID 41 tag is heated in a microwave oven. waves. Said configuration allows the resistance of the conductor 43 of the antenna 45 of the RFID tag 41 to be lower than in the embodiment of Figure 9 (for example, the resistance of the sheet of less than 100 ohms), if desired.
    [0057] The RFID tag 41 shown in Figure 10 is provided in accordance with the previous description of RFID tag 25 in Figure 9, with an RFID 47 chip electrically coupled to the conductor sheet 43 of the hybrid frame-slot antenna 45, although the antenna 45 can be configured differently without deviating from the scope of the present description.
    [0058] Regardless of the particular configuration of the antenna 45, its conductor sheet 43 is preferably formed of at least two materials (a base material and a secondary material, which can be provided in a lesser amount than the base material) having different coefficients of thermal expansion. By such a configuration, the materials expand in different
    Petition 870190057465, of 06/21/2019, p. 40/55
    21/25 coefficients when heated (for example, in a microwave oven) until the conductor sheet 43 fractures into multiple pieces or otherwise dissociates. The magnitude of the difference in the coefficients of thermal expansion of the materials can vary without deviating from the scope of the present description, although a relatively large difference may be advantageous to more quickly cause the conductor sheet 43 to fracture or otherwise break. dissociate with heating.
    [0059] In an exemplary embodiment, the conductor sheet 43 can be formed from a base material, such as a plastic material, and a second material, such as a metallic material or conductive paint, which has different coefficients of thermal expansion. More particularly, the base material may be polyethylene terephthalate (which has a thermal expansion coefficient of approximately 60 m / (m K)), although the secondary material is aluminum (which has a thermal expansion coefficient of approximately 22 m / (m K)). When joined together and heated, the aluminum will eventually break, thus rendering the RFID 41 tag inoperative or at least causing the RFID 41 tag to operate at a lower level, which reduces the interaction between the RFID 41 tag and the microwave. Although the base material has a higher coefficient of thermal expansion than the secondary material in this example, it is within the scope of the present description that the secondary material has a higher coefficient of thermal expansion. Furthermore, in one embodiment, this rupture can be promoted by including one or more weakening points or lines (which are evident in Figure 10A), such as punctuated or thinned areas of reduced thickness, which encourages the conductor sheet 43 to break in that location or particular locations.
    Petition 870190057465, of 06/21/2019, p. 41/55
    22/25 [0060] If it is desired to employ an RFID tag 11 according to a conventional configuration, the way in which it is incorporated into the packaging 49 of a food item usable in microwave can be modified. Figure 11 illustrates the package 49 which incorporates an RFID tag 11 according to a conventional configuration (as in Figure 1 A), although it is also within the scope of the present description that the RFID tag 11 is configured as in Figures 9 or 10.
    [0061] The compartment 51 of the packaging 49 is provided with a joining material 53 applied to one or more of its surfaces (illustrated in Figure 11 as an external surface). Bonding material 53 can be present as a relatively thin layer or sheet of material with a resistance that is greater than the antenna resistance of RFID tag 11 (for example, the resistance of the sheet in the range of approximately 100 ohms to approximately 230 ohms). Preferably, the bonding material 53 has a substantially uniform thickness, although it is within the scope of the present description that the bonding material 53 has a non-uniform thickness. It may be advantageous for the joint material 53 to have an average thickness that is less than the antenna thickness 17 of the RFID tag 15 (for example, the joint material 53 can have an average thickness in the range of approximately! 0 nm to approximately 100 nm for the bonding material 53 which comprises an aluminum material).
    [0062] In one embodiment, the joining material 53 comprises a metallic film. In another embodiment, the bonding material 53 comprises a paint of suitable conductivity. In other embodiments, the bonding material 53 can be configured differently, as long as it has a suitably high strength (that is, a strength that is at least
    Petition 870190057465, of 06/21/2019, p. 42/55
    23/25 greater than the antenna resistance 17 of the associated RFID tag 11 and, more preferably, the resistance of the sheet in the range of approximately 100 ohms to approximately 230 ohms).
    [0063] In the embodiment of Figure 11, a substrate 55 of the RFID tag 11 (to which the RFID chip 15 and the antenna 17 are mounted) is associated with compartment 51 in a way that positions or interposes the joining material 53 between the tag RFID 11 and compartment 51. The bonding material 53 itself can have adhesive qualities to cause the RFID 11 tag to be attached with respect to compartment 51 or a separate means can be provided for attaching the RFID 11 tag to the bonding material 53 (for example, an adhesive applied to the underside of substrate 55). Separating the fabrication of compartment 51 with the joining material 53 and the RFID tag 11 allows for greater manufacturing flexibility. By providing the bonding material 53 with a relatively high strength, the effective strength of the RFID 11 tag sheet is increased, thereby increasing the tendency to adsorb RF energy and heat, instead of creating an arc.
    [0064] The joining material 53 can be configured in a variety of ways without deviating from the scope of the present description. For example, the bonding material 53 may have a perimeter that substantially matches the perimeter of the substrate 55 of the associated RFID tag 11, a perimeter that extends ahead of the entire perimeter of the substrate 55 of the associated RFID tag 11, a perimeter that is entirely contained within the perimeter of substrate 55 of associated RFID tag 11, or a perimeter that extends ahead of the perimeter of substrate 55 of associated RFID tag 11 in at least one location, although it is contained within the perimeter of substrate 55 of associated RFID tag 11 in another location. Additionally, the perimeter of the joining material
    Petition 870190057465, of 06/21/2019, p. 43/55
    24/25 can be the same shape as the perimeter of the substrate 55 of the associated RFID tag 11 or a different shape.
    [0065] In another not illustrated aspect of the same invention, a package is provided for a food item usable in a microwave. The package includes a compartment and an RFID tag attached to the compartment. The RFID tag includes an antenna that defines a space and is configured to operate on a first frequency. An RFID chip is electrically coupled to the antenna through space. The protection structure is electrically coupled to the antenna through space and overlaps with the RFID chip. The protective structure includes a protective conductor and a protective dielectric at least partially positioned between the protective conductor and the RFID chip. The protection structure is configured to limit the voltage across the space when the antenna is exposed to a second frequency that is higher than the first frequency. The packaging compartment is provided with the connection material 53 described above, applied to one or more of its surfaces (similarly illustrated in Figure 11 as an external surface). Bonding material 53 may be present as a relatively thin layer or sheet of material with a resistance that is greater than the antenna resistance of RFID tag 11 (for example, the resistance of the sheet in the range of approximately 100 ohms to approximately 230 ohms).
    [0066] The present invention also contemplates, but is not limited to the test method to be followed for the RFID that can go to the microwave determined here. The equipment used in a method includes an inversion technology such as a 12000 Watt oven. For example, a GE® Model JE 2251SJ02 can be used. In addition, a scale and a plurality of plastic containers for containing the samples are used. In a modality of
    Petition 870190057465, of 06/21/2019, p. 44/55
    25/25 test method, frozen and ground meat was used as a sample. The steps for the test method using frozen ground beef are as follows: 1) A sample is prepared. A variety of weights can be used. In one example, a five (5) ounce sample is used. 2) The sample is placed in one half of a container to ensure that the sample covers the bottom of the container consistently between different tests. 3) The sample is frozen for approximately twelve (12) hours. 4) At least one RFID tag is glued to the bottom of the container that contains the sample and the sample is placed on a rotating plate inside a microwave oven. In one embodiment, the sample is placed in the center of the rotating plate inside the microwave oven. 5) The sample passed in the microwave in a full power setting for two (2) minutes. The present test method contemplates that several different energy configurations and times can be used to test the sample. 6) A determination is made whether there was a spark or arc.
    [0067] It will be understood that the modalities described above are illustrative of some of the applications of the principles of this subject. Numerous modifications can be made by those skilled in the art without departing from the spirit and scope of the claimed object, which includes combinations of features that are individually described or claimed here. For these reasons, the scope of this document is not limited to the above description, but is as set out in the following claims, and it is understood that the claims may be directed to the features described herein, which include combinations of features that are individually disclosed. or claimed in this document.
    权利要求:
    Claims (20)
    [1]
    1. RFID tag, characterized by the fact that it comprises:
    an antenna that defines a space and configured to operate on a first frequency;
    an RFID chip electrically coupled to the antenna through space, and a protective structure electrically coupled to the antenna through space, overlapping the RFID chip, and comprising a protective conductor, and a protective dielectric at least partially positioned between the conductor protection and the RFID chip, in which the protection structure is configured to limit the voltage across the space when the antenna is exposed to a second frequency higher than the first frequency.
    [2]
    2. RFID tag, according to claim 1, characterized by the fact that the protection dielectric is incorporated in an overlaminating layer.
    [3]
    3. RFID tag, according to claim 1, characterized by the fact that the protection structure is incorporated in an RFID strap.
    [4]
    4. RFID tag, according to claim 1, characterized by the fact that the protective conductor includes an extended area configured to dissipate the heat generated through the space and oriented so as not to overlap the antenna and the space.
    [5]
    5. RFID tag, according to claim 4, characterized by the fact that the protective conductor is formed of a non-flammable material.
    [6]
    6. RFID tag, according to claim 1, characterized by the fact that the protection dielectric is formed from
    Petition 870190057465, of 06/21/2019, p. 46/55
    2/4 a material configured to undergo a reversible or non-reversible dielectric break when the antenna is exposed to the second frequency.
    [7]
    7. RFID tag, according to claim 1, characterized by the fact that the protective conductor comprises a conductive material printed on the protective dielectric.
    [8]
    8. RFID tag, according to claim 1, characterized by the fact that it additionally comprises a second protection structure electrically coupled to the antenna through space, overlapping the RFID chip, and comprising a second protection conductor, and a second protective dielectric at least partially positioned between the second protective conductor and the antenna.
    [9]
    9. Packaging for a food item usable in microwaves, characterized by the fact that it comprises:
    one compartment; and an RFID tag attached to the compartment and which includes an antenna that defines a space and configured to operate on a first frequency, an RFID chip electrically coupled to the antenna through the space, and a protective structure electrically coupled to the antenna through the space, if overlapping the RFID chip, and comprising a protective conductor, and a protective dielectric at least partially positioned between the protective conductor and the RFID chip, where the protective structure is configured to limit the voltage across the space when the antenna it is exposed to a second frequency higher than the first frequency.
    [10]
    10. Packaging according to claim 9,
    Petition 870190057465, of 06/21/2019, p. 47/55
    3/4 characterized by the fact that the protective dielectric is incorporated in an overlaminating layer.
    [11]
    11. Packaging, according to claim 9, characterized by the fact that the protection structure is incorporated in an RFID strap.
    [12]
    12. Packaging, according to claim 9, characterized by the fact that the protective conductor includes an extended area configured to dissipate the heat generated through the space and oriented so as not to overlap the antenna and the space.
    [13]
    13. Packaging according to claim 9, characterized by the fact that the protective dielectric is formed of a material configured to undergo a reversible or non-reversible dielectric break when the antenna is exposed to the second frequency.
    [14]
    14. Packaging, according to claim 9, characterized by the fact that it additionally comprises a second protective structure electrically coupled to the antenna through the space, positioned between the antenna and the compartment, and which comprises a second protective conductor, and a second protective dielectric at least partially positioned between the second protective conductor and the antenna.
    [15]
    15. RFID tag, characterized by the fact that it comprises:
    an RFID chip; and an antenna electrically coupled to the RFID chip, in which the antenna is comprised of a conductor formed of a base material and a secondary material having different thermal expansion coefficients configured to cause the antenna to fracture into multiple parts when subjected to heating.
    Petition 870190057465, of 06/21/2019, p. 48/55
    4/4
    [16]
    16. RFID tag according to claim 15, characterized by the fact that the base material is a plastic material and the secondary material is a metallic material or conductive paint.
    [17]
    17. RFID tag according to claim 15, characterized by the fact that the base material is provided in a greater quantity than the secondary material and has a lower coefficient of thermal expansion than the secondary material.
    [18]
    18. RFID tag according to claim 15, characterized by the fact that the base material is provided in a greater quantity than the secondary material and has a higher coefficient of thermal expansion than the secondary material.
    [19]
    19. RFID tag according to claim 15, characterized by the fact that the conductor includes at least one weakening point or line having a smaller thickness than the other conductor section.
    [20]
    20. RFID tag according to claim 15, characterized by the fact that the antenna is configured as a hybrid frame-slot antenna.
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    同族专利:
    公开号 | 公开日
    JP2020042832A|2020-03-19|
    JP6613293B2|2019-11-27|
    EP3563299B1|2021-01-20|
    US20180189623A1|2018-07-05|
    EP3563299A1|2019-11-06|
    WO2018125977A1|2018-07-05|
    CN110140132A|2019-08-16|
    EP3828771A1|2021-06-02|
    JP2018163643A|2018-10-18|
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    法律状态:
    2021-10-13| B350| Update of information on the portal [chapter 15.35 patent gazette]|
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    US201662440108P| true| 2016-12-29|2016-12-29|
    US201762539817P| true| 2017-08-01|2017-08-01|
    PCT/US2017/068659|WO2018125977A1|2016-12-29|2017-12-28|Rfid tags with shielding structure for incorporation into microwavable food packaging|
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